NanoLock and Winbond to Unveil Industry’s First Secure Cloud Controller Flash Memory for IoT Devices at electronica 2018
MUNICH – NanoLock Security and Winbond will debut the first ever solution to securely protect and manage IoT devices from the device’s persistent memory all the way to the cloud at electronica 2018, November 13-16, Messe Munich. The joint solution, available for demonstrations in Hall B5 Booth 520, provides embedded lightweight, ironclad security and manages flash memory, controlled from the cloud.
“As IoT devices become more connected, the cyber threat to those devices also increases. The secure data storage is indispensable in protecting data integrity and confidentiality to prevent cyber threats,” said Hung-Wei Chen, Marketing Director, Winbond. “With nearly zero impact on our bill of materials, adding NanoLock’s IoT security solution and management platform to our secure flash memory chips allows us to provide the essential level of protection for our customers implementing these complex and secure IoT devices.”
The NanoLock and Winbond end-to-end solution ensures IoT devices, such as automotive ECUs/MCUs, cameras, ICS solutions and routers, are protected as well as managed from the cloud. The OS/CPU agnostic solution guarantees flash-to-cloud integrity and mutual protection during regular operations and firmware-over-the-air (FOTA) updates, from the production line and through and after the device’s end of life, all regardless of available processor power, energy consumption and even if the end device is inevitably hacked.
“Securing the flash memory is the most fundamental aspect of device-to-cloud protection. Our collaboration with Winbond signifies the seriousness of the IoT industry’s intent to tackle life-critical vulnerabilities stemming from unprotected IoT systems,” said Eran Fine, CEO, NanoLock. “Our joint solution ensures the network of IoT devices are fully protected and managed during operation and during the update process from the embedded layer to the cloud controlling these devices.”
The NanoLock and Winbond solution is already being tested with multiple joint customers piloting the IoT security and management platform.
- To schedule a meeting and demo with NanoLock at electronica, please contact: firstname.lastname@example.org
- NanoLock’s Technology
- NanoLock’s Intro Video
Winbond Electronics Corporation (TSE:2344) is a leading global supplier of specialty memory solutions. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services. Winbond’s product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, is widely used by tier-1 customers in the consumer, communication, computer peripheral, automotive and industrial markets. Based on a 300 mm wafer fab, Winbond keeps pace with the latest technologies to provide high-quality memory IC products. Winbond headquarters in Central Taiwan Science Park, Taiwan, and has subsidiaries in America, Japan, China, Israel and Hong Kong. For more information, please visit http://www.winbond.com.
About NanoLock Security
NanoLock Security was founded in 2016 by seasoned industry executives and formed around the founders’ and senior management’s deep understanding of how to manage and secure the new generation of connected and IoT devices. The company provides the industry’s only lightweight, unbreakable, low-cost security and management solution for connected and IoT devices. Using virtually zero computing or power resources, NanoLock Security protects firmware and sensitive information stored on connected and IoT devices, preventing attacks ranging from ransomware to malicious manipulation of stored code. NanoLock has offices in New York, Israel and Tokyo. Please visit www.nanolocksecurity.com for more information and follow NanoLock on Twitter and LinkedIn.